applications applied to a high speed signal interface, the 42510esda protects: ? digital video equipment ? mobile phone ? gps antenna ? bluetooth communication equipment antenna circuit ? ieee-1394 ? dvi ? hdmi part numbering system: 4 2510 esda- tr1 ? four channel sin 1 chip ? 2.5x1.0mm footprint size ? esda esd suppressor ? tape and reel packaging code packaging ? supplied in tape and reel packaging, 5000 parts per seven inch (178mm) reel per eia standard 481-1 ordering information four-channel esd suppressor polysurg? 42510ESDA-TR1 0810 bu-sb10816 page 1 of 2 data sheet 4378 description the cooper bussmann ? polysurg? 42510esda four-channel array esd suppressor protects sensitive electronic circuits from the threat of electrostatic discharge (esd) without distorting data signals. this protection is a result of its ultra-low capacitance (0.1pf typical) that is well suited for hdmi esd protection applications. features ? halogen free, lead free and rohs compliant for global applications ? ultra-low capacitance (0.1pf typical) ideally suited for protecting high speed data applications ? provides esd protection with fast response time (<1ns) allowing equipment to pass the iec 61000-4-2 level 4 test ? four (4) channel array ? zero signal distortion ? low leakage current (<0.01a typical) pb halogen hf free * note, capacitance measured with 1v rms surface mount device electrical specifications characteristic value/range rated voltage (max) 12v leakage current (max @ 12vdc) 0.01 a trigger voltage (v t ) 300v typical clamping voltage (v c ) 30v typical capacitance (cp) @1mhz* 0.1pf typical response time <1ns esd voltage capability, iec 61000-4-2 8kv contact discharge mode esd voltage capability, iec 61000-4-2 15kv air discharge mode esd withstand pulses 100 times minimal catalog number description 42510ESDA-TR1 5000 suppressors in paper tape on a 7 inch (178mm) reel environmental specifications characteristic value load humidity +85c/90%rh with rated voltage for 1000 hrs thermal shock -40c to +85c, 30 minute cycle, 5 cycles moisture resistance test j-std-020 standard: level 2 (1 year floor life under 30c/65%rh conditions operating temperature range -40c to +85c (-40f to 185f) storage temperature range -55c to +125c (-67f to +257f)
l w e t b c d ? 2010 cooper bussmann www.cooperbussmann.com 0810 bu-sb10816 page 2 of 2 data sheet 4378 the only controlled copy of this data sheet is the electronic read-only version located on the cooper bussmann network drive. al l other copies of this document are by definition uncontrolled. this bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with desig n applications. cooper bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. cooper bussmann also reserves t he right to change or update, without notice, any technical information con- tained in this bulletin. once a product has been selected, it should be tested by the user in all possible applications. life support policy: cooper bussmann does not authorize the use of any of its products for use in life support devices or system s without the express written approval of an officer of the company. life sup- port systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instr uctions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. soldering recommendations ? compatible with lead and lead-free solder reflow processes ? hand soldering - soldering tip should not directly touch part - 280c max for 3 sec. max ? peak reflow temperatures and durations: - ir reflow = 260c max for 20 sec. max - wave solder = 260c max for 10 sec. max recommended ir reflow profile tape and reel packaging specifications - mm dimensions - mm recommended pad layout - mm gpp 1 xx 1 yy 1 z 0.2 0.5 1 0.2 0.3 0.6 1.4 1.4 note: print solder 0.01~0.015mm thick. bc d e l t w 0.2 0.3 0.2 0.5 2.5 0.5 1.0 0.1 0.05 0.05 0.05 0.1 0.1 0.1 7 r s 7 d s h ) / : ( ' $ & % unit: mm ab c d e f lw 8.00 3.50 1.75 2.00 4.00 1.50 2.90 1.40 0.30 0.05 0.10 0.05 0.10 0.10 0.20 0.20 design considerations ? follow the soldering recommendations to avoid deforming product ? do not use high temperature, high humidity or corrosive atmospheres (sulfide and chloride gas) that could damage the solderability ? moisture sensitivity level (msl) according to j-std-020 standard: level 2 (floor life 1 year under <30c/65%rh conditions) ? solderability requirement according to ipc/jedec j-std-002c, test d, test b1 ? use sn/ag/cu (96.5/3.0/0.5) or equivalent solder and activated flux #5 or equivalent. circuit schematic hdmi application
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